Electrical deposition apparatus

ABSTRACT

An electrical deposition apparatus includes a brush plating head. The brush plating head includes a plurality of channels, and there are openings at the same surface of the brush plating head. Each of the channels extends from within the brush plating head to each of the openings.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 104219438, filed on Dec. 3, 2015. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

TECHNICAL FIELD

The present disclosure relates to an electrical deposition apparatus.

BACKGROUND

In an electrical deposition process, when the workpiece size is up totens of meters, it is not easy to build a giant electroplating bath forelectrical deposition. Thus, a 3D electroplating method to deposit metalis needed. The so-called 3D electroplating method belongs to brushplating in the electrical deposition process particularly.

When the brush plating is applied to the electrical deposition, thedeposition efficiency of some metal (e.g., chromium) is not high becauseit is not easy for reduction and precipitation, and there is a tendencyfor ionization. To solve the above problems, high current density isrequired to use in the electrical deposition process. However, brushplating apparatuses may generate heat due to the high current densitypassing through, and high temperature may also cause the efficiency ofmetal deposition to become worse.

SUMMARY

The present disclosure provides an electrical deposition apparatusincluding a brush plating head. The brush plating head includes aplurality of channels, and there are openings at the same surface of thebrush plating head. Each of the channels extends from within the brushplating head to each of the openings.

Based on the above, the electrical deposition apparatus provided by thepresent disclosure can increase the reaction area of the brush platinghead in the process of electrical deposition and improve the currentdensity at the end of the brush plating head by the channels in thebrush plating head, so as to increase the efficiency of metaldeposition.

Several exemplary embodiments accompanied with figures are described indetail below to further describe the disclosure in details.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the disclosure.

FIG. 1 is a schematic view of an electrical deposition apparatusaccording to a first embodiment of the present disclosure.

FIG. 2A and FIG. 2B are schematic three-dimensional views of two variantembodiments of a brush plating head of the first embodiment.

FIG. 3 is a schematic cross-sectional view of an electrical depositionapparatus according to a second embodiment of the present disclosure.

FIG. 4 is a schematic cross-sectional view of a variant embodiment of abrush plating head of the second embodiment.

FIG. 5 is a schematic cross-sectional view of an electrical depositionapparatus according to a third embodiment of the present disclosure.

FIG. 6A is a schematic cross-sectional view of an electrical depositionapparatus according to a fourth embodiment of the present disclosure.

FIG. 6B is a schematic three-dimensional view of a cover plate in FIG.6A.

FIG. 6C is a schematic cross-sectional view of another electricaldeposition apparatus according to the fourth embodiment of the presentdisclosure.

FIG. 6D is a schematic three-dimensional view of a cover plate in FIG.6C.

FIG. 6E is a schematic cross-sectional view of yet another electricaldeposition apparatus according to the fourth embodiment of the presentdisclosure.

FIG. 6F is a schematic three-dimensional view of a cover plate in FIG.6E.

FIG. 7 is a schematic three-dimensional view of another variantembodiment of the cover plate of the fourth embodiment.

DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS

FIG. 1 is a schematic view of an electrical deposition apparatusaccording to a first embodiment of the present disclosure.

Referring to FIG. 1, an electrical deposition apparatus 100 includes abrush plating head 102, wherein the brush plating head 102 includes aplurality of channels 104, and there are openings 104 a at the samesurface 102 a of the brush plating head 102. Each of the channels 104extends from within the brush plating head 102 to each of the openings104 a. The electrical deposition apparatus 100 also has an electricpower supply 106 electrically connected to the brush plating head 102and a to-be-plated workpiece 108 respectively. Also, since the brushplating head 102 in FIG. 1 is connected to a grip 110, the electricpower supply 106 is electrically connected to the brush plating head 102through the grip 110 indirectly. In the embodiment, the surface 102 ahaving the openings 104 a is a flat surface. However, in otherembodiments, the surface 102 a may also be an arc surface or acorresponding shape designed corresponding to the to-be-plated workpiece108 with different shape. The present disclosure is not limited to theflat surface. The present disclosure is not limited the shape of thebrush plating head 102. As long as the brush plating head 102 includesthe channels 104 therein, it belongs to the scope of the presentdisclosure. The shape of the brush plating head 102 can be changedaccording to the needs of the product design by those skilled in theart. For example, the brush plating head 102 may also be roundpie-shaped, and be with a proper grip, which can be applied to a rotarybrush pen. Furthermore, by the design of the brush plating head 102having the plurality of channels 104, the weight of the brush platinghead 102 can be reduced. Thus, the brush plating head 102 is easier tooperate. A plating solution recycle device 112 may also be disposed atthe position corresponding to the to-be-plated workpiece 108 of theelectrical deposition apparatus 100. The plating solution recycle device112 is used to recover a plating solution dropped from the to-be-platedworkpiece 108. The plating solution can be supplied to the brush platinghead 102 during electroplating by using an extra plating solution supplydevice 114. In other embodiments, the plating solution may be suppliedto the brush plating head 102 by the plating solution supply device 114,and then the plating solution may reach the to-be-plated workpiece 108through pipelines (not shown) in the grip 110.

In the embodiment, the plating solution is selected from gold (Au),silver (Ag), nickel (Ni), iron (Fe), copper (Cu), cobalt (Co), zinc(Zn), tin (Sn), tungsten (W), lead (Pb), cadmium (Cd), indium (In),chromium (Cr) plating solutions. For example, cobalt-nickel,tungsten-nickel, nickel-phosphorus, iron-nickel, cadmium-nickel,cadmium-zinc, cobalt-nickel-phosphorus, nickel-zinc, zinc-tin, tin-lead,antimony-copper-tin, indium-copper alloy plating solutions.Additionally, the plating solution may also be selected from compositeplating solutions of metal and oxide, metal and nitride, or metal andinorganic substances.

In FIG. 1, the channels 104 in the brush plating head 102 are slitchannels. However, the present disclosure is not limited thereto. Thebrush plating head of the first embodiment may be as shown in FIG. 2Aand FIG. 2B.

In FIG. 2A, a brush plating head 200 has a plurality of pillarstructures 202 to form a plurality of channels 204. Since the channels204 are composed of the pillar structures 202, the end thereof mayproduce point discharge. Thus, the current density is further increased.Also, by using the brush plating head 200 with high current density, theproblems that some metal (e.g., chromium) is not easy to be reduced andprecipitated can be avoided. Additionally, although a top surface 202 aof the pillar structure 202 of FIG. 2A is a flat surface, it can bedesigned to an arc surface or other shape according to the needs. InFIG. 2B, the channels 208 in the brush plating head 206 are concavechannels, and openings 208 a thereof are in dotted distributed. When thepillar structures 202 of FIG. 2A are separated from each other, pointdischarge can be produced at the pillar structure 202 and an end of oneside close to a workpiece (e.g. 108 of FIG. 1) in the process ofoperating the electrical deposition apparatus. Thus, the current densitycan be further increased. By using the brush plating head 200 with highcurrent density, the problems that some metal (e.g., chromium) is noteasy to be reduced and precipitated can be avoided.

FIG. 3 is a schematic view of an electrical deposition apparatusaccording to a second embodiment of the present disclosure.

Referring to FIG. 3, an electrical deposition apparatus 300 of theembodiment is similar to the first embodiment. The electrical depositionapparatus 300 includes a brush plating head 302, a plurality of channels304 located in the brush plating head 302, an electric power supply 306,a to-be-plated workpiece 308, a plating solution recycle device 312 forrecycling a plating solution, and a plating solution supply device 314.In the second embodiment, the to-be-plated workpiece 308 is disposed onan electrode plate 310, and thus the electric power supply 306 iselectrically connected to the brush plating head 302 and the electrodeplate 310 respectively. Additionally, by a pump 318, the recycledplating solution in the plating solution recycle device 312 is suppliedto the plating solution supply device 314, and then entering a platingsolution supply duct 316 in the brush plating head 302. Additionally,bubbles may be produced during the electrical deposition, and theproduction of bubbles may cause the reaction area to become smaller.Also, the burning is easy to happen. Thus, the plating solution supplyduct 316 may also be changed to as an exhaust vent to use. By the designof the exhaust vent, the production of bubbles can be exhausted duringthe electrical deposition. Thus, the problems of reduction of reactionarea and burning with the process of electrical deposition can beavoided. Additionally, by a connection channel 320 connected to theplurality of channels 304, the production of bubbles in the channels 304can be guided to exhaust. If the position of the connection channel 320is lower, the plating solution in the channels 304 may be uniformlymixed through the connection channel 320. Additionally, the electricaldeposition apparatus 300 may further include a friction pad 322 coveringat least a surface 302 a having openings 304 a. During the electricaldeposition, the brush plating head 302 is electrically connected to apositive electrode of the electric power supply 306, and theto-be-plated workpiece 308 is electrically connected to a negativeelectrode of the electric power supply 306 through the electrode plate310, such that the brush plating head 302, the plating solution, and theto-be-plated workpiece 308 perform a redox reaction. The metal to beplated is reduced on the to-be-plated workpiece 308. The friction pad322 is disposed between the brush plating head 302 and the to-be-platedworkpiece 308, which can avoid the problems of the short circuit betweenthe brush plating head 302 and the to-be-plated workpiece 308. Also, thefriction pad 322 can make the plating solution pass through.

In FIG. 3, the channels 304 in the brush plating head 302 aredistributed at equal distance, and have the same width. However, thepresent disclosure is not limited thereto. The brush plating head of thesecond embodiment may be as shown in FIG. 4.

Referring to FIG. 4, channels 402 a to 402 b of a brush plating head 400are distributed at unequal distance. For example, a width W1 of thechannel 402 a located at an edge of the brush plating head 400 is morethan a width W2 of the channel 402 b located at a center of the brushplating head 400. Since temperature rising may cause the efficiency ofmetal deposition to become worse, the design may improve the situationof overheating at the edge region caused by the larger current densityat the edge region of the brush plating head 400.

FIG. 5 is a schematic cross-sectional view of an electrical depositionapparatus according to a third embodiment of the present disclosure.

Referring to FIG. 5, an electrical deposition apparatus 500 of the thirdembodiment not only includes components of a brush plating head 502, aplurality of channels 504 located in the brush plating head 502, anelectric power supply 508, a to-be-plated workpiece 510, and anelectrode plate 512, but also has a spacer 506 disposed on a surface 502a having openings 504 a. Since the spacer 506 is disposed between thebrush plating head 502 and the to-be-plated workpiece 510, the problemsof the short circuit between the brush plating head 502 and theto-be-plated workpiece 510 can be avoided, of which the effect issimilar to the friction pad 322 in FIG. 3.

FIG. 6A is a schematic cross-sectional view of an electrical depositionapparatus according to a fourth embodiment of the present disclosure.

Referring to FIG. 6A, an electrical deposition apparatus 600 of thefourth embodiment not only includes components of a brush plating head602, a plurality of channels 604 located in the brush plating head 602,an electric power supply 606, a to-be-plated workpiece 608, an electrodeplate 610, and a friction pad 612, but also has a cover plate 614disposed at a surface 602 a having openings 604 a. The cover plate 614includes a plurality of through holes 616, of which thethree-dimensional view is as shown in FIG. 6B, and the through holes 616of the cover plate 614 are connected to the openings 604 a respectively.The connection between the cover plate 614 and the brush plating head602 may be achieved by using an extra fastener (not shown) or aconnection part (not shown) of a slot or a latch. The effect of thecover plate 614 is to adjust the plating solution output amount in thebrush plating head 602. Thus, the through holes 616 of the cover plate614 not only have a fixed hole diameter d1 as shown in FIG. 6A, but alsohave other different variants.

FIG. 6C is a schematic cross-sectional view of another electricaldeposition apparatus according to the fourth embodiment of the presentdisclosure, wherein the component notations the same as FIG. 6A are usedto represent the same or similar components. As shown in FIG. 6C, acover plate 618 also has a plurality of through holes 620, of which thethree-dimensional view is as shown in FIG. 6D. However, a hole diameterd2 of the through holes 620 close to the brush plating head 602 is morethan a hole diameter d3 of the through holes 620 away from the brushplating head 602. Thus, in the process of moving the brush plating head602, the plating solution is easier to form a vortex, so as to increasethe cooling effect of the brush plating head 602.

FIG. 6E is a schematic cross-sectional view of yet another electricaldeposition apparatus according to the fourth embodiment of the presentdisclosure, wherein the component notations the same as FIG. 6A are usedto represent the same or similar components. A cover plate 622 of FIG.6E can be provided with through holes 624 and a connection channel 626connected to the through holes 624, of which the three-dimensional viewis as shown in FIG. 6F. The effect of the connection channel 626 issimilar to the connection channel 320 of FIG. 3, which can be connectedto an exhaust vent 602 b disposed in the brush plating head 602, so asto exhaust the bubbles formed during the electrical deposition.Moreover, the problems of reduction of reaction area and burning can befurther avoided. Additionally, the exhaust vent 602 b may also bechanged to connect to the channels of the plating solution supply devicefor supplying the plating solution to the brush plating head 602.

FIG. 7 is a schematic three-dimensional view of another variantembodiment of the cover plate of the fourth embodiment. In FIG. 7, acover plate 700 may further include a plurality of blind holes 702. Theblind holes 702 are toward the to-be-plated workpiece (608), and aredisconnected from the openings (604 a). During the electricaldeposition, the blind hole 702 may be used as another space fortemporarily keeping the plating solution, such that the plating solutionis uniformly distributed on the to-be-plated workpiece (608) to improvethe uniformity of electrical deposition. Additionally, the through holesof the cover plate 700 can have different design and distributionaccording to the needs, such as a dot-shaped through hole 704, a slitthrough hole 706, a dashed-line through hole 708, or a combinationthereof The present disclosure is not limited to the shape of thethrough holes 704 to 708, and the shape and distribution thereof can beadjusted according to the needs of the product by those skilled in theart.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of thedisclosed embodiments without departing from the scope or spirit of thedisclosure. In view of the foregoing, it is intended that the disclosurecover modifications and variations of this disclosure provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. An electrical deposition apparatus, comprising abrush plating head, the brush plating head comprises a plurality ofchannels, and a plurality of openings is disposed at one surface of thebrush plating head, wherein each of the channels extends from within thebrush plating head to each of the openings.
 2. The electrical depositionapparatus according to claim 1, wherein the brush plating head has aplurality of pillar structures to form the plurality of channels.
 3. Theelectrical deposition apparatus according to claim 1, wherein thesurface having the plurality of openings comprises a flat surface or anarc surface.
 4. The electrical deposition apparatus according to claim1, further comprising a plating solution recycle device.
 5. Theelectrical deposition apparatus according to claim 1, further comprisinga plating solution supply device used for supplying a plating solutionto the brush plating head.
 6. The electrical deposition apparatusaccording to claim 5, wherein the brush plating head further comprises aplating solution supply duct used for supplying the plating solution tothe channels.
 7. The electrical deposition apparatus according to claim5, further comprising: a plating solution recycle device configured torecycle the plating solution; and a pump configured to supply therecycled plating solution to the plating solution supply device.
 8. Theelectrical deposition apparatus according to claim 1, wherein thechannels in the brush plating head are distributed at unequal distance.9. The electrical deposition apparatus according to claim 8, wherein awidth of the channel located at an edge of the brush plating head ismore than a width of the channel located at a center of the brushplating head.
 10. The electrical deposition apparatus according to claim1, further comprising a friction pad covering at least the surfacehaving the openings.
 11. The electrical deposition apparatus accordingto claim 1, further comprising a spacer disposed at the surface havingthe openings.
 12. The electrical deposition apparatus according to claim1, wherein the brush plating head further comprises a connection channelconnected to the plurality of channels.
 13. The electrical depositionapparatus according to claim 12, wherein the brush plating head furthercomprises an exhaust vent connected to the connection channel.
 14. Theelectrical deposition apparatus according to claim 1, further comprisinga cover plate, disposed at the surface having the openings, wherein thecover plate comprises a plurality of through holes connected to theopenings respectively.
 15. The electrical deposition apparatus accordingto claim 14, wherein the cover plate further comprises a plurality ofblind holes disconnected from the openings.
 16. The electricaldeposition apparatus according to claim 14, wherein each of the throughholes has a fixed hole diameter.
 17. The electrical deposition apparatusaccording to claim 14, wherein a hole diameter of the through holesclose to the brush plating head is more than a hole diameter of thethrough holes away from the brush plating head.
 18. The electricaldeposition apparatus according to claim 14, wherein the through holescomprise a dot-shaped through hole, a slit through hole, a dashed-linethrough hole, or a combination thereof.
 19. The electrical depositionapparatus according to claim 14, wherein the cover plate furthercomprises a connection channel connected to the plurality of throughholes.
 20. The electrical deposition apparatus according to claim 19,wherein the brush plating head further comprises an exhaust ventconnected to the connection channel.